Test Engineering. Failure Analysis. Answers.
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Digital and Analog Testing & Non-destructive Failure Analysis
Datest supports a wide range of industries with advanced electrical test and nondestructive inspection services, including:
Advanced Imaging with
Datest has expanded its non-destructive inspection capabilities with the addition of the Viscom iX7059 XL 3D CT AXI system, enabling 100% solder joint inspection and advanced internal analysis across prototype, pre-production, and production assemblies.
This system allows customers to gain fast, high-resolution insight into solder joints, BGAs, QFNs, vias, and internal structures, without damaging hardware. With high-energy 180kV X-ray capability and support for large, complex PCBAs, Datest can inspect boards that many in-house AXI systems simply can’t handle due to size, construction, or material stack-ups
SPEA Flying Probe Testing Expertise
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Datest provides end-to-end SPEA flying probe services for prototype, pre-production, and production PCBAs. We operate and program a full range of SPEA platforms, including the 4020, 4030, 4050, 4060, and 4080, giving customers a scalable test solution as designs and volumes change.
Beyond test execution, Datest offers expert flying probe programming and coverage analysis before, during, and after test, ensuring each strategy delivers meaningful, cost-effective results. This approach enables rapid implementation, high confidence coverage, and, when combined with AXI, a powerful alternative to traditional In-Circuit Test (ICT).
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Smarter Test Decisions with Siemens
Before committing to a test strategy, Datest uses Siemens to analyze PCB designs and determine what you’re really dealing with.
TestWay allows us to:
This data-driven approach prevents over-testing, under-testing, and costly missteps
The Outcome: Answers You Can Act On
Datest doesn’t push a specific test method. We apply the right combination of electrical testing, imaging, and analysis to give you answers you can trust.
Less guesswork. Faster decisions. Problems solved.
