Test Engineering. Failure Analysis. Answers.
|
Nordson Dage XD7600NT500 Ruby
Restrictions in manufacturing materials and ever-increasing expectations for reliability mean ensuring quality product manufacture is more critical than ever. Ruby enables you to prove your quality and reduce product returns from the field, and the associated cost and damage to reputation.
- Spot quality process trends early using advanced measurement tools for distance measurement and voiding.
- Ensure IPC-A-610 and IPC-7095 compliance with built-in checking for BGA and QFN voiding, solder ball diameter, roundness, bridge, and missing.
- See assembly defects clearly with 0.50µm image resolution.
The Medalist i3070 Board Test Family is the broadest and most compatible family of board test systems available on the market today. Designed to handle a wide variety of test strategies, technologies, printed circuit boards (PCBs), and budgets, the Medalist i3070 Series 5 family offers a specific test system to fit your exact requirements. System enhancements include Silicon Nails, NanoVTEP, and x1149 JTAG.
SPEA 4060 S2 Dual-Sided Flying Probe with LED & High Density Wafer Test Capability
The SPEA 4060 Automatic Flying Probe Tester is a Multi-Mode Dual-sided Probing tester (four top probes, two bottom probes). It was constructed using structural steel in Italy. This tester can be used for Micro-SMDs, flexible circuits, as well as traditional standard circuit boards.
- Dual side probing: full accessibility & parallel test
- Maximum Board Size 24” x 27” (610mm x 686mm)
- 20 kg max board weight
- Full test coverage with optical assist
- Nodal Impedance Testing (NZT)—Net-Based Shorts & Opens Testing
- Micro-SMD & flexible circuit probing
- Leonardo Advanced programming and parametric debug capability
Viscom iX7059 XL 3D AXI Inspection System
Datest’s latest addition, the Viscom iX7059 XL, delivers true 3D X-ray inspection using advanced computed tomography (CT) technology, ideal for high-reliability applications in aerospace, automotive, and power electronics.
- True 3D CT slice imaging for precise internal analysis
- 180kV, 90W Microfocus Xray Tube
- Handles large boards up to 1000 mm length, 610 mm width, and 15 kg (33lb)
- Standard resolution 8-20µm
- Offline programming capability
- Detects head-in-pillow, voiding, solder fill issues, and hidden structural defects
- Inline-capable with high throughput and full traceability
- Real-time radiation dosage predictive measurements and traceability
This system brings unmatched depth, accuracy, and insight to our inspection lineup, helping customers see more, prove more, and trust more.
VJ Technologies Microfocus CT System
As product designs become more complex and materials more dense, true internal visibility is no longer optional; it’s essential. The VJ Technologies Microfocus CT System enables Datest to perform high-resolution 2D, oblique, and true 3D computed tomography (CT) inspection of a wide range of components and assemblies, from electronics to aerospace hardware.
This system enables detailed inspection of dense materials and complex geometries—without cutting, sectioning, or destroying the part. The result: clear, defensible insight into internal structures, defects, and failure mechanisms that other inspection methods simply can’t reveal.
Key Capabilities & Benefits:
- True 3D CT reconstruction with high-resolution volumetric detail
- Microfocus X-ray technology for sharp, precise imaging
- Ideal for dense materials and larger assemblies
- Supports defect detection, dimensional analysis, voiding, cracking, and internal feature verification
- Non-destructive inspection for failure analysis, qualification, and validation
